Ïàòåíò ÑØÀ ¹ | 6160349 |
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Àâòîð(û) | Nagai |
Äàòà âûäà÷è | 12 äåêàáðÿ 2000 ã. |
A panel (10) and a drive circuit substrate (12) are disposed within a conductive shielding case (20). Between the panel (10) and the drive circuit substrate (12), a conductive holding board (16) or separately provided conductive material is provided, and connected to the conductive shielding case (20) by a connecting means (22) so as to surround the drive circuit substrate (12) to be the source of noise. This forms an electromagnetic shield for the drive circuit (12). Further, a conductive layer is formed on an upper part of an insulating film of a wiring board (25) which connects the panel (10) and the drive circuit substrate (12). The conductive layer may be connected to, for example, the conductive shielding case (20) and the holding board (16) to be forced to have a ground potential. This provides an electromagnetic shield to the wiring board (25) as well as preventing emission of noise from a gap between the panel (10) and the conductive shielding case (20).
Àâòîðû: | Takayoshi Nagai (Tokyo, JP) |
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Çàÿâèòåëü: | Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
ID ñåìåéñòâà ïàòåíòîâ | 13930288 |
Íîìåð çàÿâêè: | 09/050,023 |
Äàòà ðåãèñòðàöèè: | 30 ìàðòà 1998 ã. |
Apr 7, 1997 [JP] | 09-087991 | |||
Êëàññ ïàòåíòíîé êëàññèôèêàöèè ÑØÀ: | 315/85; 349/59 |
Êëàññ ñîâìåñòíîé ïàòåíòíîé êëàññèôèêàöèè: | G02F 1/133308 (20130101); G02F 1/13452 (20130101); H01J 1/52 (20130101); H01J 29/003 (20130101); H01J 2211/446 (20130101); G02F 2001/133334 (20130101) |
Êëàññ ìåæäóíàðîäíîé ïàòåíòíîé êëàññèôèêàöèè (ÌÏÊ): | G02F 1/13 (20060101); H01J 29/00 (20060101); H01J 1/00 (20060101); H01J 1/52 (20060101); H01J 001/52 () |
Îáëàñòü ïîèñêà: | ;315/85 ;345/904,905,903 ;349/59,58,138,158 |
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