Патент США № | 6589601 |
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Автор(ы) | Shimada |
Дата выдачи | 08 июля 2003 г. |
In the process for producing a laminated substrate (1) such as electronic substrates (2; 3), when applying a sealing agent (7) to the end face of substrates (2; 3) combined together to seal it, first the sealing agent (7) is applied to a target area in the form of successive beads (7), and then a stream of compressed gas (10) is blown against the successive beads (7) from a gas ejecting nozzle (9) so as to scan the successive beads (7). The method can effectively fill the indentation or the stepped area formed along the end face with the sealing agent (7).
Авторы: | Takaji Shimada (Kawaguchi, JP) |
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Заявитель: | Nordson Corporation (Westlake, OH) |
ID семейства патентов | 15609452 |
Номер заявки: | 09/959,225 |
Дата регистрации: | 02 января 2002 г. |
PCT Filed: | April 21, 2000 |
PCT No.: | PCT/JP00/02634 |
PCT Pub. No.: | WO00/65630 |
PCT Pub. Date: | November 02, 2000 |
Apr 23, 1999 [JP] | 11-155594 | |||
Класс патентной классификации США: | 427/348; 427/230; 427/419.2; 427/58 |
Класс совместной патентной классификации: | B05C 5/0216 (20130101); B05C 11/06 (20130101); F16J 15/14 (20130101); H01J 9/32 (20130101); H01J 9/323 (20130101); H01J 29/90 (20130101); H01J 9/261 (20130101); H01J 2217/49264 (20130101) |
Класс международной патентной классификации (МПК): | B05C 5/02 (20060101); B05C 11/06 (20060101); B05C 11/02 (20060101); F16J 15/02 (20060101); F16J 15/14 (20060101); H01J 29/00 (20060101); H01J 29/90 (20060101); H01J 9/26 (20060101); H01J 9/32 (20060101); B05D 003/12 (); B05D 005/12 (); B05D 001/36 () |
Область поиска: | ;427/419.2,58,230,348 |
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