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Pat. 10014245 United States, Int. Cl.22 H01L 21/302, B23P 15/00, C03C 25/00, C23F 1/00, H01B 13/00, H01L 21/02, H01L 21/304, H01L 21/3065, H01L 21/308, H01L 21/461, H01L 21/48, H01L 21/56, H01L 21/66, H01L 21/67, H01L 21/78, H01L 23/00, H01L 23/31, H01L 23/482, H01L 23/495, H01L 23/498, H01L 23/544, H01L 25/00, H01L 25/065, H01L 27/146, H02M 3/158. Method for removing material from a substrate using in-situ thickness measurement : Appl. N 15/244979 : Filed 23.08.2016 : Pub. 03.07.2018 : / Michael J. Seddon, Francis J. Carney ; Assignee Semiconductor Components Industries LLC ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10014245/en?oq=US10014245.html (дата обращения: ДД.ММ.ГГГГ).