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Pat. 10037930 United States, Int. Cl.22 H01L 23/433, H01L 21/48, H01L 23/043, H01L 25/18, H02M 7/00, H02M 7/44. Power semiconductor module and manufacturing method of power semiconductor module : Appl. N 15/320345 : Filed 11.05.2015 : Pub. 31.07.2018 : / Takashi Kume, Takahiro Shimura, Akira Matsushita, Shinichi Fujino, Yusuke Takagi ; Assignee Hitachi Automotive Systems Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10037930/en?oq=US10037930.html (дата обращения: ДД.ММ.ГГГГ).