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Pat. 10079195 United States, Int. Cl.22 H01L 23/12, H01L 21/48, H01L 21/56, H01L 23/00, H01L 23/31, H01L 23/373, H01L 25/18, H02M 3/158, H02M 5/293, H02M 5/297, H02M 7/217, H02M 7/537. Semiconductor chip package comprising laterally extending connectors : Appl. N 15/292554 : Filed 13.10.2016 : Pub. 18.09.2018 : / Wolfram Hable, Martin Gruber, Juergen Hoegerl ; Assignee Infineon Technologies Ag ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10079195/en?oq=US10079195.html (дата обращения: ДД.ММ.ГГГГ).