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Pat. 10079199 United States, Int. Cl.22 H01L 23/498, H01L 21/02, H01L 21/304, H01L 21/3065, H01L 21/308, H01L 21/48, H01L 21/56, H01L 21/66, H01L 21/67, H01L 21/78, H01L 23/00, H01L 23/31, H01L 23/482, H01L 23/495, H01L 23/544, H01L 25/00, H01L 25/065, H02M 3/158, H01L 27/146. Through-substrate via structure and method of manufacture : Appl. N 15/244737 : Filed 23.08.2016 : Pub. 18.09.2018 : / Michael J. Seddon, Francis J. Carney ; Assignee Semiconductor Components Industries LLC ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10079199/en?oq=US10079199.html (дата обращения: ДД.ММ.ГГГГ).