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Pat. 10079212 United States, Int. Cl.22 H01L 23/538, H01L 23/00, H01L 23/13, H01L 23/15, H01L 23/31, H01L 23/373, H01L 23/48, H01L 23/482, H01L 23/492, H01L 23/498, H01L 25/18, H01L 29/16, H01L 29/739, H01L 29/861, H02M 7/5387, H02M 7/00. Semiconductor device having solder groove : Appl. N 15/279444 : Filed 29.09.2016 : Pub. 18.09.2018 : / Naoki Takizawa ; Assignee Fuji Electric Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10079212/en?oq=US10079212.html (дата обращения: ДД.ММ.ГГГГ).