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Pat. 10128165 United States, Int. Cl.22 H01L 23/28, H01L 21/48, H01L 21/56, H01L 23/00, H01L 23/31, H01L 23/367, H01L 23/373, H01L 23/498, H01L 25/00, H01L 25/07, H01L 25/18, B60L 11/18, H02M 7/00. Package with vertically spaced partially encapsulated contact structures : Appl. N 15/796771 : Filed 28.10.2017 : Pub. 13.11.2018 : / Wolfram Hable, Andreas Grassmann, Juergen Hoegerl, Eduard Knauer, Michael Ledutke ; Assignee Infineon Technologies Ag ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10128165/en?oq=US10128165.html (дата обращения: ДД.ММ.ГГГГ).