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Pat. 10141254 United States, Int. Cl.22 H01L 23/52, H01L 23/367, H01L 23/498, H01L 23/64, H01L 25/18, H02K 11/33, H02M 7/00, H01L 23/00. Direct bonded copper power module with elevated common source inductance : Appl. N 15/978552 : Filed 14.05.2018 : Pub. 27.11.2018 : / Zhuxian Xu, Chingchi Chen ; Assignee Ford Global Technologies LLC ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10141254/en?oq=US10141254.html (дата обращения: ДД.ММ.ГГГГ).