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Pat. 10176926 United States, Int. Cl.22 H01G 4/40, H01F 17/00, H01F 27/28, H01F 27/29, H01G 4/30, H02M 3/04, H05K 1/18, H01G 4/228, H05K 3/34. Composite electronic component : Appl. N 15/133827 : Filed 20.04.2016 : Pub. 08.01.2019 : / Seong Min Chin, Je Ik Moon, Ye Eun Jung ; Assignee Samsung Electro Mechanics Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10176926/en?oq=US10176926.html (дата обращения: ДД.ММ.ГГГГ).