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Pat. 10199316 United States, Int. Cl.22 H01L 23/498, H01L 21/02, H01L 21/288, H01L 21/304, H01L 21/3065, H01L 21/308, H01L 21/48, H01L 21/56, H01L 21/66, H01L 21/67, H01L 21/683, H01L 21/768, H01L 21/78, H01L 23/00, H01L 23/31, H01L 23/48, H01L 23/482, H01L 23/495, H01L 23/544, H01L 25/00, H01L 25/065, H01L 27/02, H01L 27/088, H01L 27/14, H01L 27/146, H01L 29/08, H02M 3/158, H01L 23/15. Semiconductor device and method of aligning semiconductor wafers for bonding : Appl. N 15/817423 : Filed 20.11.2017 : Pub. 05.02.2019 : / Michael J. Seddon, Francis J. Carney ; Assignee Semiconductor Components Industries LLC ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10199316/en?oq=US10199316.html (дата обращения: ДД.ММ.ГГГГ).