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Pat. 10217683 United States, Int. Cl.22 H01L 23/31, H01L 23/00, H01L 23/057, H01L 23/28, H01L 23/49, H01L 23/495, H02M 7/00, H02M 7/53, H02M 7/538, H02P 27/06. Mounted semiconductor module with a mold resin portion : Appl. N 15/541919 : Filed 13.05.2015 : Pub. 26.02.2019 : / Dai Yoshii, Masaaki Tanigawa, Kensuke Takeuchi ; Assignee Mitsubishi Electric Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10217683/en?oq=US10217683.html (дата обращения: ДД.ММ.ГГГГ).