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Pat. 10256212 United States, Int. Cl.22 H01L 23/00, H01L 23/367, H01L 25/065, H01L 25/07, H01L 25/18, H01L 27/06, H01L 29/06, H01L 29/739, H02M 7/00, H01L 29/08, H01L 29/10, H02M 1/32, H02M 7/5387, H02P 27/06. Semiconductor chip having multiple pads and semiconductor module including the same : Appl. N 15/570876 : Filed 27.05.2016 : Pub. 09.04.2019 : / Kenji Kouno, Hiromitsu Tanabe ; Assignee Denso Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10256212/en?oq=US10256212.html (дата обращения: ДД.ММ.ГГГГ).