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Pat. 10276466 United States, Int. Cl.22 H01K 11/00, H01L 21/56, H01L 23/13, H01L 23/28, H01L 23/40, H01L 23/495, H01L 25/07, H01L 25/18, H02K 11/00, H02K 11/33, H05K 7/14, H01L 23/373, H02M 7/00. Semiconductor device and semiconductor device mounting method : Appl. N 15/576277 : Filed 29.05.2015 : Pub. 30.04.2019 : / Mitsumasa Sasaki ; Assignee Shindengen Electric Manufacturing Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10276466/en?oq=US10276466.html (дата обращения: ДД.ММ.ГГГГ).