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Pat. 10305411 United States, Int. Cl.22 H02P 27/00, H01L 23/538, H01L 25/07, H01L 25/16, H02M 7/00, H02M 7/5387, H02P 3/24, H02P 27/06, H01L 23/00, H02M 1/32, H02M 1/42, H02P 3/22. Semiconductor module : Appl. N 15/492073 : Filed 20.04.2017 : Pub. 28.05.2019 : / Maki Hasegawa, Takuya Shiraishi ; Assignee Mitsubishi Electric Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10305411/en?oq=US10305411.html (дата обращения: ДД.ММ.ГГГГ).