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Pat. 10332818 United States, Int. Cl.22 H01L 23/34, H01L 21/48, H01L 23/00, H01L 23/367, H01L 23/538, H01L 25/07, H05K 1/02, H05K 1/18, H05K 3/30, H05K 3/46, H02M 7/06. Efficient heat removal from component carrier with embedded diode : Appl. N 15/880055 : Filed 25.01.2018 : Pub. 25.06.2019 : / Mike Morianz, Gerald Weis, Johannes Stahr ; Assignee At&Saustriatechnologie Und Systemtechnik Ag ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10332818/en?oq=US10332818.html (дата обращения: ДД.ММ.ГГГГ).