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Pat. 10340906 United States, Int. Cl.22 H02M 3/07, H01L 27/07, H01L 29/78, H03K 17/06, H03K 17/16, H03K 17/687, H03K 19/0185, H01L 29/10, H01L 29/423. Integrated bootstrap high-voltage driver chip and technological structure thereof : Appl. N 15/779432 : Filed 23.01.2017 : Pub. 02.07.2019 : / Weifeng Sun, Yunwu Zhang, Kuo Yu, Jing Zhu, Shen Xu, Qinsong Qian, Siyang Liu, Shengli Lu, Longxing Shi ; Assignee Southeast University-Wuxi Integrated Circuit Technology Research Institute, Southeast University ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10340906/en?oq=US10340906.html (дата обращения: ДД.ММ.ГГГГ).