Библиографическая ссылка на патент
Pat. 10424522 United States, Int. Cl.22 H01L 23/053, H01L 21/48, H01L 21/50, H01L 23/00, H01L 23/02, H01L 23/04, H01L 23/055, H01L 23/08, H01L 23/10, H01L 23/14, H01L 23/28, H01L 23/31, H01L 23/48, H05K 7/14, H01L 23/373, H02M 7/00, H02M 7/537, H02P 27/06. Case, semiconductor device and manufacturing method of case : Appl. N 15/905753 : Filed 26.02.2018 : Pub. 24.09.2019 : / Rikihiro Maruyama ; Assignee Fuji Electric Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10424522/en?oq=US10424522.html (дата обращения: ДД.ММ.ГГГГ).