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Pat. 10461736 United States, Int. Cl.22 H03K 17/16, H02M 1/08, H02M 1/32, H02M 3/158, H02M 7/537, H02M 7/5387, H02M 1/00. Semiconductor device : Appl. N 16/278337 : Filed 18.02.2019 : Pub. 29.10.2019 : / Yoshitaka Kato, Kenji Komiya, Yusuke Shindo, Yoshinori Hayashi, Kenichi Wakabayashi ; Assignee Denso Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10461736/en?oq=US10461736.html (дата обращения: ДД.ММ.ГГГГ).