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Pat. 10541195 United States, Int. Cl.22 H01L 23/495, G08C 17/06, H01L 23/66, H02M 3/06, H02M 3/07, H04B 5/00, H04L 25/02. Package structure of capacitive coupling isolator : Appl. N 16/165763 : Filed 19.10.2018 : Pub. 21.01.2020 : / You-Fa Wang, Wei-Wen Lai, Pu-Han Lin, Yuan-Lung Wu ; Assignee Lite On Singapore Pte Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10541195/en?oq=US10541195.html (дата обращения: ДД.ММ.ГГГГ).