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Pat. 10553517 United States, Int. Cl.22 H01L 23/473, H01L 23/00, H01L 23/31, H01L 23/367, H01L 23/373, H01L 25/00, H01L 25/11, H01L 25/18, H02M 7/5387. High power module semiconductor package with multiple submodules : Appl. N 15/874355 : Filed 18.01.2018 : Pub. 04.02.2020 : / Jie Chang, Huibin Chen, Keunhyuk Lee, Jerome Teysseyre ; Assignee Semiconductor Components Industries LLC ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10553517/en?oq=US10553517.html (дата обращения: ДД.ММ.ГГГГ).