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Pat. 10553524 United States, Int. Cl.22 H01L 23/495, H01L 21/48, H01L 23/00, H01L 23/433, H01L 21/56, H01L 23/31, H02M 7/00. Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad : Appl. N 16/058729 : Filed 08.08.2018 : Pub. 04.02.2020 : / Man Kit Lam ; Assignee Microchip Technology Inc ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10553524/en?oq=US10553524.html (дата обращения: ДД.ММ.ГГГГ).