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Pat. 10559509 United States, Int. Cl.22 H01L 23/14, H01L 23/12, H01L 23/15, H01L 25/00, H01L 25/07, H01L 25/18, H02M 7/48, H05K 1/16. Insulating substrate and semiconductor device using same : Appl. N 16/099457 : Filed 09.08.2017 : Pub. 11.02.2020 : / Hiroshi Hozoji, Kenji Hayashi, Hiroyuki Itoh, Hisayuki Imamura, Hiroyuki Nagatomo ; Assignee Hitachi Metals Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10559509/en?oq=US10559509.html (дата обращения: ДД.ММ.ГГГГ).