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Pat. 10580754 United States, Int. Cl.22 H01L 25/065, G01K 7/01, H01L 23/00, H01L 23/057, H01L 23/31, H01L 23/48, H01L 23/495, H01L 23/498, H01L 23/538, H01L 25/07, H01L 25/10, H01L 25/11, H01L 25/16, H01L 25/18, H01L 27/02, H02M 1/00, H02M 7/00, H02M 7/48, H02M 7/5387, G01K 7/22, H01L 23/24, H01L 23/29, H01L 23/367, H01L 29/16, H01L 29/739, H01L 29/78, H02M 1/32. Semiconductor module with temperature detecting element : Appl. N 16/078991 : Filed 13.03.2017 : Pub. 03.03.2020 : / Shinya Yano, Shinichi Kinouchi, Yasushi Nakayama ; Assignee Mitsubishi Electric Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10580754/en?oq=US10580754.html (дата обращения: ДД.ММ.ГГГГ).