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Pat. 10672757 United States, Int. Cl.22 H02M 3/158, H01L 27/02, H02M 1/00. Multiphase parallel direct-current (DC) to DC circuit and chip structure thereof : Appl. N 16/518373 : Filed 22.07.2019 : Pub. 02.06.2020 : / Jiake Wang, Yue Chen, Qiang Xie ; Assignee Huawei Technologies Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10672757/en?oq=US10672757.html (дата обращения: ДД.ММ.ГГГГ).