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Pat. 10707160 United States, Int. Cl.22 H01L 23/498, H01L 21/48, H01L 21/768, H01L 23/00, H01L 23/482, H01L 23/495, H01L 23/50, H01L 27/06, H01L 29/423, H02M 3/335, H01L 27/088, H02M 3/158. Electrical connectivity of die to a host substrate : Appl. N 15/817712 : Filed 20.11.2017 : Pub. 07.07.2020 : / Robert T. Carroll ; Assignee Infineon Technologies North America Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10707160/en?oq=US10707160.html (дата обращения: ДД.ММ.ГГГГ).