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Pat. 10727145 United States, Int. Cl.22 H01L 23/24, H01L 23/00, H01L 23/04, H01L 23/049, H01L 23/10, H01L 23/28, H01L 23/29, H01L 23/31, H01L 23/373, H01L 25/07, H01L 25/18, H02M 7/5387, H02P 27/08. Semiconducter device with filler to suppress generation of air bubbles and electric power converter : Appl. N 16/323021 : Filed 20.09.2017 : Pub. 28.07.2020 : / Hiroyuki Harada, Kozo Harada, Hiroki Shiota, Yoshihiro Yamaguchi, Koji Yamada ; Assignee Mitsubishi Electric Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10727145/en?oq=US10727145.html (дата обращения: ДД.ММ.ГГГГ).