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Pat. 10727213 United States, Int. Cl.22 H01L 25/16, H01L 25/07, H01L 25/18, H02M 7/00, H02M 7/48, H03H 7/01, H03H 7/06, H03H 11/04, H01L 23/00, H01L 23/367. Power semiconductor module and power semiconductor device : Appl. N 16/320500 : Filed 15.09.2017 : Pub. 28.07.2020 : / Junichi Nakashima, Yoshiko Tamada, Yasushi Nakayama ; Assignee Mitsubishi Electric Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10727213/en?oq=US10727213.html (дата обращения: ДД.ММ.ГГГГ).