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Pat. 10756625 United States, Int. Cl.22 H03H 9/02, G01K 7/01, G01K 7/34, G01K 11/26, H01L 41/08, H01L 41/113, H01L 41/18, H02M 3/156, H03H 9/05, H03H 9/08, H03H 9/145, H03H 9/205, H03H 9/25, H03H 9/54, H03H 9/64, H03H 9/70, H03H 9/72, H02M 3/155. Integrated module of acoustic wave device with active thermal compensation and an active thermal compensating method thereof : Appl. N 15/634481 : Filed 27.06.2017 : Pub. 25.08.2020 : / Re Ching Lin, Shu Hsiao Tsai, Cheng Kuo Lin, Chih-Feng Chiang, Fan Hsiu Huang, Tung-Yao Chou ; Assignee Win Semiconductors Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10756625/en?oq=US10756625.html (дата обращения: ДД.ММ.ГГГГ).