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Pat. 10763190 United States, Int. Cl.22 H01L 23/495, H01L 21/00, H01L 21/52, H01L 23/00, H01L 23/06, H01L 23/34, H01L 23/473, H01L 25/07, H01L 25/18, H02M 7/00, H02M 7/537, H05K 7/20. Power semiconductor module, power conversion device using same, and method for manufacturing power conversion device : Appl. N 16/099651 : Filed 11.05.2016 : Pub. 01.09.2020 : / Nobutake Tsuyuno, Morio Kuwano, Takeshi Tokuyama ; Assignee Hitachi Automotive Systems Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10763190/en?oq=US10763190.html (дата обращения: ДД.ММ.ГГГГ).