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Pat. 10777499 United States, Int. Cl.22 H01L 23/498, H01L 21/48, H01L 23/15, H01L 23/31, H01L 23/373, H01L 25/07, H02M 7/00, H02M 7/537. Semiconductor module, method for manufacturing the same and power conversion apparatus : Appl. N 15/969809 : Filed 03.05.2018 : Pub. 15.09.2020 : / Yasuo Tanaka ; Assignee Mitsubishi Electric Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10777499/en?oq=US10777499.html (дата обращения: ДД.ММ.ГГГГ).