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Pat. 10825764 United States, Int. Cl.22 H01L 23/498, H01L 21/02, H01L 21/288, H01L 21/304, H01L 21/3065, H01L 21/308, H01L 21/48, H01L 21/56, H01L 21/66, H01L 21/67, H01L 21/683, H01L 21/768, H01L 21/78, H01L 23/00, H01L 23/31, H01L 23/48, H01L 23/482, H01L 23/495, H01L 23/544, H01L 25/00, H01L 25/065, H01L 27/02, H01L 27/088, H01L 27/14, H01L 27/146, H01L 29/08, H02M 3/158, H01L 23/14, H01L 23/15, H01L 23/367. Semiconductor device and method of forming micro interconnect structures : Appl. N 16/131462 : Filed 14.09.2018 : Pub. 03.11.2020 : / Francis J. Carney, Jefferson W. Hall, Michael J. Seddon ; Assignee Semiconductor Components Industries LLC ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10825764/en?oq=US10825764.html (дата обращения: ДД.ММ.ГГГГ).