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Pat. 10840178 United States, Int. Cl.22 H01L 23/495, H01L 23/367, H01L 23/498, H02M 7/00, H05K 7/14, H05K 7/20, H02M 1/32. Circuit assembly and mounting unit : Appl. N 16/174445 : Filed 30.10.2018 : Pub. 17.11.2020 : / Shuichi Sato, Tetsunori Tsumuraya ; Assignee Molex LLC ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10840178/en?oq=US10840178.html (дата обращения: ДД.ММ.ГГГГ).