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Pat. 10855190 United States, Int. Cl.22 H02M 3/335, H01F 27/24, H01F 27/28, H01F 30/12, H02M 3/28. Magnetic integrated device including multiple core columns and windings and power conversion circuit : Appl. N 16/212822 : Filed 07.12.2018 : Pub. 01.12.2020 : / Heqian Yang, Changsheng Pei, Yongtao Liang ; Assignee Huawei Technologies Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10855190/en?oq=US10855190.html (дата обращения: ДД.ММ.ГГГГ).