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Pat. 10923562 United States, Int. Cl.22 H01L 29/06, H01L 21/02, H01L 21/04, H01L 21/28, H01L 21/322, H01L 21/76, H01L 21/78, H01L 23/31, H01L 23/495, H01L 29/10, H01L 29/12, H01L 29/16, H01L 29/32, H01L 29/40, H01L 29/66, H01L 29/78, H01L 29/20, H01L 29/739, H02M 5/293. Semiconductor device, and method for manufacturing semicondcutor device : Appl. N 16/325963 : Filed 10.08.2017 : Pub. 16.02.2021 : / Seigo Mori, Masatoshi Aketa ; Assignee Rohm Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10923562/en?oq=US10923562.html (дата обращения: ДД.ММ.ГГГГ).