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Pat. 10985084 United States, Int. Cl.22 H01L 23/373, H01L 21/8238, H01L 23/34, H01L 23/36, H01L 23/367, H01L 23/48, H01L 29/20, H02M 3/158, H05K 1/02. Integrated III-V device and driver device packages with improved heat removal and methods for fabricating the same : Appl. N 16/502266 : Filed 03.07.2019 : Pub. 20.04.2021 : / Donald Ray Disney ; Assignee Globalfoundries Us Inc ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US10985084/en?oq=US10985084.html (дата обращения: ДД.ММ.ГГГГ).