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Pat. 11024571 United States, Int. Cl.22 H01L 23/498, H01F 17/00, H01F 27/28, H01F 27/29, H01F 27/32, H02M 3/00, H02M 3/04, H05K 1/16, H05K 3/46. Coil built-in multilayer substrate and power supply module : Appl. N 16/361277 : Filed 22.03.2019 : Pub. 01.06.2021 : / Keito Yonemori ; Assignee Murata Manufacturing Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11024571/en?oq=US11024571.html (дата обращения: ДД.ММ.ГГГГ).