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Pat. 11024731 United States, Int. Cl.22 H01L 29/78, H01L 21/04, H01L 25/18, H01L 27/06, H01L 29/06, H01L 29/16, H01L 29/739, H01L 29/04, H01L 29/66, H02M 7/00, H02P 7/03. Power module for supporting high current densities : Appl. N 16/171521 : Filed 26.10.2018 : Pub. 01.06.2021 : / Jason Patrick Henning, Qingchun Zhang, Sei-Hyung Ryu, Anant Kumar Agarwal, John Williams Palmour, Scott Allen ; Assignee Cree Inc ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11024731/en?oq=US11024731.html (дата обращения: ДД.ММ.ГГГГ).