Библиографическая ссылка на патент
Pat. 11069602 United States, Int. Cl.22 H01L 23/495, H01L 23/28, H01L 25/18, H02M 1/08, H02M 7/00, H02M 7/537, H01L 23/00. Package and terminal arrangement for semiconductor module : Appl. N 16/349292 : Filed 22.11.2016 : Pub. 20.07.2021 : / Shuhei Yokoyama, Shogo Shibata, Maki Hasegawa, Koichiro Noguchi, Shigeru Mori, Toru Iwagami ; Assignee Mitsubishi Electric Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11069602/en?oq=US11069602.html (дата обращения: ДД.ММ.ГГГГ).