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Pat. 11081969 United States, Int. Cl.22 H02M 7/00, B23K 9/013, B23K 9/10, B23K 9/16, B23K 9/32, H02M 1/42, H05K 1/02, H05K 1/14, H05K 1/18, H05K 3/30, H05K 7/14. Printed circuit board arrangement for welding and cutting apparatus : Appl. N 15/915374 : Filed 08.03.2018 : Pub. 03.08.2021 : / Awad Gharib, Muniswamappa Anjanappa, Pranav Sanghavi ; Assignee Esab Group Inc ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11081969/en?oq=US11081969.html (дата обращения: ДД.ММ.ГГГГ).