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Pat. 11094455 United States, Int. Cl.22 H01F 27/24, H01F 27/02, H01F 27/28, H01F 27/34, H01F 41/00, H02M 3/158. Module with reversely coupled inductors and magnetic molded compound (MMC) : Appl. N 16/233804 : Filed 27.12.2018 : Pub. 17.08.2021 : / Dongbin Hou, Sombuddha Chakraborty, Kenji Kawano, Jeffrey Morroni, Yuki Sato ; Assignee Texas Instruments Inc ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11094455/en?oq=US11094455.html (дата обращения: ДД.ММ.ГГГГ).