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Pat. 11101267 United States, Int. Cl.22 H01L 27/088, H01L 21/8234, H01L 23/535, H01L 27/02, H01L 27/092, H01L 29/06, H02M 7/00. Integrated circuit including multiple-height cell and method of manufacturing the integrated circuit : Appl. N 16/444252 : Filed 18.06.2019 : Pub. 24.08.2021 : / Jin-Young Lim, Jae-Ho Park, Sang-Hoon Baek, Hyeon-Gyu You, Dal-Hee Lee ; Assignee Samsung Electronics Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11101267/en?oq=US11101267.html (дата обращения: ДД.ММ.ГГГГ).