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Pat. 11121123 United States, Int. Cl.22 H05K 3/46, H01L 21/48, H01L 23/498, H01L 25/16, H02M 3/00. Semiconductor composite device and package board used therein : Appl. N 16/907557 : Filed 22.06.2020 : Pub. 14.09.2021 : / Koshi Himeda, Tatsuya Kitamura, Chiharu Sakaki, Shinya Kiyono, Sho Fujita, Atsushi Yamamoto, Takeshi Furukawa, Kenji Nishiyama, Tatsuya Funaki, Kinya Aoki ; Assignee Murata Manufacturing Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11121123/en?oq=US11121123.html (дата обращения: ДД.ММ.ГГГГ).