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Pat. 11139297 United States, Int. Cl.22 H01L 27/092, H01L 23/00, H01L 23/495, H02M 7/00, H02M 7/493, H03K 17/687. Circuit arrangement, redistribution board, module and method of fabricating a half-bridge circuit : Appl. N 16/358309 : Filed 19.03.2019 : Pub. 05.10.2021 : / Elvir Kahrimanovic ; Assignee Infineon Technologies Austria Ag ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11139297/en?oq=US11139297.html (дата обращения: ДД.ММ.ГГГГ).