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Pat. 11211304 United States, Int. Cl.22 H01L 23/32, H01L 21/50, H01L 21/60, H01L 23/08, H01L 23/40, H01L 23/495, H02M 7/00, H05K 7/20. Assembly and method for mounting an electronic component to a substrate : Appl. N 16/104600 : Filed 17.08.2018 : Pub. 28.12.2021 : / Ralf Otremba, Guenther Lohmann, Bernd Schmoelzer, Fabian Schnoy ; Assignee Infineon Technologies Austria Ag ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11211304/en?oq=US11211304.html (дата обращения: ДД.ММ.ГГГГ).