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Pat. 11239224 United States, Int. Cl.22 H05K 1/14, H01L 23/50, H01L 25/18, H02M 7/00, H02M 3/158, H02M 7/5387, H02P 27/06. Power conversion device including a plurality of semiconductor modules : Appl. N 16/785913 : Filed 10.02.2020 : Pub. 01.02.2022 : / Kazuma Fukushima, Yuu Yamahira, Ryota Tanabe, Tetsuya Matsuoka, Kosuke Kamiya, Taijiro Momose ; Assignee Denso Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11239224/en?oq=US11239224.html (дата обращения: ДД.ММ.ГГГГ).