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Pat. 11302595 United States, Int. Cl.22 H01L 23/36, H01L 21/50, H01L 23/538, H01L 23/60, H02M 3/158. Package assembly and method for manufacturing the same, package assembly of buck converter : Appl. N 17/025106 : Filed 18.09.2020 : Pub. 12.04.2022 : / Ke Dai, Jian Wei, Jiajia Yan ; Assignee Hefei Silergy Semiconductor Technology Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11302595/en?oq=US11302595.html (дата обращения: ДД.ММ.ГГГГ).