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Pat. 11348896 United States, Int. Cl.22 H01L 23/00, B60R 16/033, H02M 7/00. Method for producing a semiconductor module by using adhesive attachment prior to sintering : Appl. N 16/844341 : Filed 09.04.2020 : Pub. 31.05.2022 : / Chunlei Liu, Fabian Mohn, Jurgen Schuderer ; Assignee Hitachi Energy Switzerland Ag, Audi Ag ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11348896/en?oq=US11348896.html (дата обращения: ДД.ММ.ГГГГ).
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