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Pat. 11355477 United States, Int. Cl.22 H01L 25/07, H01G 2/06, H01G 4/40, H01L 23/00, H01L 25/18, H02M 7/48. Power semiconductor module and power conversion device : Appl. N 16/479839 : Filed 02.02.2018 : Pub. 07.06.2022 : / Takeshi Horiguchi, Yuji Miyazaki, Tatsunori Yanagimoto ; Assignee Mitsubishi Electric Corp ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11355477/en?oq=US11355477.html (дата обращения: ДД.ММ.ГГГГ).