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Pat. 11356034 United States, Int. Cl.22 H02M 7/487, G01R 19/175, H02M 1/38, H02M 7/5387, H02M 1/00. Multi-level inverter clamping modulation method and apparatus, and inverter : Appl. N 17/088088 : Filed 03.11.2020 : Pub. 07.06.2022 : / Fei Xu, Fei Ye, Lei Shi ; Assignee Huawei Digital Power Technologies Co Ltd ; NN p. : patents.google.com : URL: https://patents.google.com/patent/US11356034/en?oq=US11356034.html (дата обращения: ДД.ММ.ГГГГ).